About the role
AI summarisedThe Staff Engineer, Package Development & Engineering provides technical leadership and strategic oversight for advanced packaging initiatives within Micron's Advanced Packaging & Technology Development organization. This role drives technology enablement, yield acceleration, and integration of next-generation packaging solutions through cross-functional team leadership, governance frameworks, and performance monitoring. The position requires deep expertise in advanced packaging flows such as hybrid bonding, CoWoS, and chiplet integration, along with strong technical communication and leadership skills.
IDMOnsiteAssembly & Test
Key Responsibilities
- Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure
- Define technical objectives, key deliverables, and resource allocation for pillar initiatives
- Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones
- Develop and enforce standardized methodologies for technical program management and pillar governance
- Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems
- Ensure compliance with internal governance models and customer technical requirements
- Align pillar objectives with PDE’s mission to embed analytics, simulation, and advanced modeling into development workflows
- Facilitate technical communication across BU, PDT, TPM, and central engineering teams
- Provide leadership updates on technical progress, risks, and mitigation strategies
- Define and monitor KPIs for technology maturity, yield performance, and EOL accountability
- Conduct technical reviews to validate outcomes and capture lessons learned
- Mentor engineers and promote best practices for technical program management
Requirements
- Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline
- 8+ years of experience in semiconductor packaging, process integration, or technology development
- Proven ability to lead complex, cross-functional technical programs in a high-tech environment
- Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration
- Strong technical communication and leadership skills
- Familiarity with Micron’s PDE, CPI, and NPI frameworks
- Expertise in simulation modeling, yield enhancement, and defectivity analysis