About the role
AI summarisedThe Senior/Staff/Principal Advanced Packaging Technology Development Integrator at Micron is responsible for developing and qualifying advanced packaging processes, materials, equipment, and technologies to support new technology nodes. This role involves leading process readiness efforts, improving yield and reliability through characterization and optimization, and driving collaboration across cross-functional teams to resolve process-related challenges and ensure smooth transitions from development to production.
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Key Responsibilities
- Develop advanced packaging process solutions for new technology nodes
- Ensure success of new process, new equipment, new material, and path finding activities for all advanced packaging products
- Lead new technology node process readiness and improve yield, quality, and reliability through process characterization and optimization
- Introduce new materials, machines, and technologies to support process advancement
- Drive and collaborate with cross-functional teams to resolve process-related problems
- Develop and qualify new packaging processes, materials, equipment, and technology solutions to meet new technology node requirements and schedule
- Perform CPI NUDD, process TRA, risk mitigation execution, and process recipe readiness prior to silicon arrival to ensure first pass rate
- Qualify new process, technology, equipment, and materials
- Identify path finding opportunities for technology leadership with focus on BIC time to market, yield improvement, cost efficiency, and touchpoint optimization
- Understand future trends, technologies, and capabilities required for future packaging solutions and work with teams to implement new capabilities
Requirements
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience
- 6 years' and/or above experience in semiconductor industry
- Experience in Frontend fab Process integration or Module process
- Experience in Backend advance packaging wafer/ die level process or integration
- Understanding of silicon integration and how it interacts at backend process & package level through CPI
- Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
- Experience in temporary/ permanent bonding technology (Wafer on wafer, Chip on wafer) is a plus
- Strong project management skills to ensure execution to timelines
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Ability to integrate & cooperate with people from cross function teams