About the role
AI summarisedThe Staff Engineer in Global Wafer Logistic Automation at Micron provides technical leadership for automated wafer packaging systems, including FOSB, HWS, and Hybox equipment. Responsibilities include driving process improvements, ensuring global consistency in operations, supporting supplier collaborations, and enabling new fab rollouts through layout analysis and deployment coordination. The role requires a bachelor’s degree in engineering and 7+ years of experience in semiconductor manufacturing or warehouse automation, with hands-on expertise in automated packaging systems and strong analytical and communication skills.
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Key Responsibilities
- Provide technical ownership and engineering support for mechanised packaging solutions, including FOSB and HWS/BHWS Auto Packer, Auto Unpacker, and Auto Packer and Unpacker for Hybox applications
- Provide support and advance HWS (Horizontal Wafer Shipper) packing operations, covering process definition, validation, and sustained improvement
- Promote worldwide consistency in equipment specifications, process flows, and operating procedures for semiconductor packaging and shipping
- Partner with equipment suppliers to define requirements, review builds, support FAC/SAC, and resolve technical and operational issues
- Assist new fab wafer logistic automation rollouts by conducting layout reviews, evaluating capacity, and coordinating deployment efforts
- Analyse equipment and process performance data to identify improvement opportunities in efficiency, reliability, ergonomics, and safety
- Collaborate with AMHS, warehouse operations, EHS, quality, and IT teams to ensure compliance with Micron policies and standards
- Develop and maintain engineering documentation, specifications, and standard process guidelines
- Provide technical mentorship and training to site engineers and operations teams
- Support technology roadmaps and future automation initiatives related to wafer packaging and logistics
Requirements
- Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, Automation Engineering, or a related field
- 7+ years of engineering experience in semiconductor manufacturing, warehouse automation, or wafer logistics
- Hands‑on experience with FOSB and HWS Auto Packer / Auto Unpacker / Hybox Auto Packer/Unpacker systems, preferably supporting FOSB, HWS, Hybox or equivalent wafer shipping containers
- Demonstrated expertise in automated packaging systems and semiconductor logistics
- Solid technical knowledge in equipment specification, process flow, and operating procedures
- Working knowledge of HWS (Horizontal Wafer Shipper) packing processes
- Outstanding analytical skills to determine and successfully implement process improvements
- Ability to collaborate effectively across global, cross‑functional teams
- Excellent written and verbal communication skills, with the ability to deliver clear technical guidance and mentorship
- Experience supporting multi‑site or global deployments of automated packaging or warehouse systems is advantageous
- Familiarity with AMHS, ASRS, or automated warehouse environments is advantageous
- Experience working directly with equipment vendors throughout the equipment lifecycle is advantageous
- Knowledge of semiconductor EHS, ergonomics, and cleanroom requirements is advantageous