About the role
AI summarisedAs a Staff/Principal Engineer in CMP Advanced NAND at Micron Technology, you will lead the development and optimization of chemical mechanical planarization processes for next-generation 3D NAND memory devices. You will work with cross-functional teams to drive innovation in CMP consumables, hardware evaluation, and process control methodologies while mentoring junior engineers and collaborating globally with vendors and internal stakeholders. This role requires deep expertise in semiconductor CMP processes, strong technical leadership, and the ability to define roadmaps for advanced memory nodes.
IDMOnsite
Key Responsibilities
- Develop and optimize chemical mechanical planarization procedures to improve product quality and reliability for next-generation Micron memory parts
- Perform fundamental research, consumables development, and hardware evaluation for advanced 3D NAND CMP process development
- Test processes for novel applications in advanced 3D NAND CMP development
- Initiate and manage experiments to widen process margins and evaluate manufacturability of next-node solutions
- Collaborate with vendors to develop processes meeting integration requirements for current and next-generation 3D NAND nodes
- Incorporate best-known manufacturing methods into early development phases of upcoming nodes
- Design and implement advanced process monitoring and control methodologies
- Provide strategic roadmap for N+, N++, and future NAND nodes
- Serve as a technical expert contributing to technical projects for improvements to processes, procedures, and equipment
- Define and lead complex, multi-functional projects of critical importance to Micron, helping to define strategic direction
- Provide advice and counsel to management on significant technical issues, leading and initiating innovation projects through patents and technical papers
Requirements
- Masters/PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry
- Background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication
- Hands-on experience with CMP equipment operation such as AMAT (LKP), EBARA-300X, and next-generation CMP equipment
- Experience with optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
- Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
- Understanding of various integration and structural impacts and constraints related to film deposition and upstream/downstream processes
- Excellent oral and written communication skills with ability to convey messages concisely and effectively in local and remote communications
- Strong collaboration and communication skills (verbal and written)
- Self-driven, adaptable, and able to manage multiple projects