About the role
AI summarisedThe Principal Engineer for NAND Advanced Thin Films Process Development at Micron Technology leads the strategic development and implementation of thin film processes for next-generation NAND memory. This role involves defining technical direction, leading multi-functional teams, overseeing end-to-end process module development, resolving complex technical challenges, mentoring engineers, and driving technology transfer from R&D to high-volume manufacturing. The position requires deep expertise in thin film deposition, process-device interactions, reliability engineering, and advanced characterization techniques, with a focus on manufacturability, scalability, and innovation for advanced memory technology.
IDMFull-timeSTPG
Key Responsibilities
- Define and implement the technical strategy for structural and electrical film process development, ensuring alignment with both business and technology objectives
- Lead multi-functional teams in the development, integration, and scaling of thin film processes specifically tailored for advanced NAND structures and devices
- Oversee the end-to-end development of process modules, with a strong focus on manufacturability, scalability, and readiness for integration
- Resolve complex technical challenges that have significant business implications, including root cause analysis and mitigation of process/device failures
- Mentor senior engineers and influence the technical direction throughout the organization, fostering a culture of technical excellence and innovation
- Represent the function in technical forums and participate in strategic collaborations, including industry consortia, technical conferences, and joint development projects
- Deliver solutions that enable and maintain a competitive leadership position in advanced memory technology, including benchmarking against industry standards
- Drive technology transfer and ramp-up activities, ensuring seamless transition from R&D to high-volume manufacturing
- Identify and evaluate emerging trends, risks, and opportunities in structural and electrical film technology, providing recommendations for future investments and critical initiatives
- Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and material utilization
Requirements
- Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications
- In-depth knowledge of process-device and mechanical interactions, challenges associated with technology/device scaling, and the principles of reliability engineering for next-generation memory nodes
- Proven track record of developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems
- Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis)
- Strong foundation in thin film process development using plasma and thermal methods, especially for dielectric (including lowK and highK films), carbon-based films, with an ability to analyze structural-process correlations and conduct failure analysis
- Experience in benchmarking technology, conducting competitive analyses, and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements
- Ability to lead cross-disciplinary teams in the development and deployment of new process technologies, including collaboration with integration, device, reliability, and manufacturing engineering groups
- Proficiency in