About the role
AI summarisedThe Package Health Engineer at Micron Technology will develop and execute package health monitoring, simulation, and characterization activities. This role involves DFT, data analysis, and reliability testing to ensure robust packaging solutions in the semiconductor industry.
IDMFull-timeHIG
Key Responsibilities
- Develop and implement DFT strategies for advanced packaging.
- Conduct simulations for mechanical, thermal, and electrical performance.
- Perform electrical and mechanical characterization of packages.
- Analyze test and field data to identify early indicators of package degradation.
- Collaborate with data scientists to build predictive models for package health.
- Support root cause analysis and corrective actions for reliability issues.
Requirements
- Bachelor's or advanced degree in Engineering or Science is required
- Strong analytical, logical, and critical thinking skills
- Effective communicator, able to collaborate across all levels
- Growth mindset with a passion for continuous learning
- Internship or experience in the semiconductor industry is a plus
- Demonstrated leadership and a track record of impact are highly desirable
- Interest in and knowledge of the semiconductor industry and Micron is preferred
- Basic knowledge of data analysis and scripting (e.g., Python, MATLAB)
- Experience with Visual Basic for automation and tool integration is preferred.
- Hands-on experience with simulation tools and test equipment.
- Experience with AI/ML tools or statistical modeling.
- Familiarity with JEDEC or other reliability standards.
- Strong problem-solving and documentation skills