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Micron Technology

Sr. Manager, Package Design/Development Quality Assurance

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 months ago
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About the role

AI summarised

Senior Manager leading a Package Design/Development Quality Assurance (DDQA) engineering team at Micron, a semiconductor memory and storage company. Responsible for enabling introduction of advanced package technologies by identifying and mitigating chip-package interaction risks, reliability concerns, and customer integration challenges. Combines technical authority, people leadership, and cross-functional influence to drive near-term results and long-term technology impact.

IDMFull-timeQuality

Key Responsibilities

  • Lead DDQA strategy for new package technology introductions, with focus on CPI and customer integration risks
  • Drive early identification and mitigation of package-level reliability and interaction risks
  • Define and oversee characterization and reliability test strategies
  • Guide development of fundamental understanding of package-related failure mechanisms
  • Ensure effective root cause analysis and closure of package technology quality issues
  • Drive systematic capture and reuse of lessons learned in next-generation technologies
  • Act as a technical escalation point for package-related customer quality and integration issues
  • Lead, mentor, and develop a highly technical DDQA engineering team
  • Set clear expectations, performance goals, and development plans for direct reports
  • Build technical depth, engagement, and succession within the organization
  • Foster a culture of accountability, collaboration, and technical excellence
  • Drive internal and external technical publications related to package reliability and CPI

Requirements

  • 10+ years of experience in one or more of the following areas: Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, and/or Failure Analysis
  • Demonstrated ability to lead and develop senior technical engineers
  • Strong knowledge of semiconductor package assembly and surface-mount processes
  • Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability
  • Working knowledge of industry reliability test methods, acceleration models, and sampling statistics
  • Experience applying FMEA and structured problem-solving methodologies (e.g., 8D)
  • Strong analytical skills with the ability to translate complex data into clear technical decisions
  • Proven ability to collaborate across functions and influence outcomes in complex technical environments