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Micron Technology

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 months ago
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About the role

AI summarised

Principal Engineer/MTS leading HBM Product Engineering Media Health team at Micron, a semiconductor memory company. Responsible for reliability test development, DPM reduction, root cause analysis, and cross-functional collaboration to drive quality, cost, and cycle time improvements for HBM products.

IDMFull-timeHIG

Key Responsibilities

  • Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
  • Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
  • DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI's Quality, Cost and Cycle Time.
  • Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
  • Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields.
  • Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions.
  • Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition.
  • Mentorship and Development of Others: The role involves actively developing and mentoring others.
  • Project Management: Developing project management skills within the team ensures efficient execution of projects.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization.
  • Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team.

Requirements

  • Bachelors/Masters Electrical and Electronics Engineering Degree with 8+ years of experience in the semiconductor industry.
  • Product Engineering experience is preferred.
  • Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.
  • Good knowledge of statistics and data analysis tools and scripting.
  • Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
  • Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
  • Strong sense of responsibility and accountability towards assigned role with professional work ethic.
  • Excellent communication and presentation skills.
  • Passionate about people leadership, with a drive toward ongoing learning and development in this area.
  • Work on site in Singapore with international travel opportunity to US, Taiwan and Japan.