About the role
AI summarisedThe Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate Principal Scientist to advance state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes. This role involves developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, alongside conducting electrical and reliability characterization.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Collaborate with senior staff, process integrators, and external partners on technology roadmaps and business challenges.
- Lead high-impact projects with manageable risks and mentor less experienced colleagues.
- Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
- Research and develop advanced packaging technology including flip-chip & hybrid bonding for 2.5D and 3D IC applications.
- Investigate and refine wafer bonding processes for interposer fabrication, gap fill, and alignment accuracy.
- Optimize die bonding processes, including material selection, surface preparation, and bonding methods.
- Conduct engineering experiments for process characterization to drive quality and yield improvements.
- Perform reliability characterization of hybrid-bonded packages to ensure robustness and long-term performance.
- Act as a Subject Matter Expert (SME) for internal and external stakeholders.
Requirements
- PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
- 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration.
- Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
- Strong knowledge of hybrid bonding equipment technologies, bonding materials, and methodologies.
- Proficiency in data analysis, interpretation, and design of experiments.
- Strong analytical and problem-solving skills.
- Excellent written and verbal communication abilities.
- Ability to work collaboratively in a research-oriented environment.