Micron Technology

Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 2 weeks ago

About the role

AI summarised

The Engineer, HIG-HBM Product & System Engineering role at Micron focuses on driving manufacturing execution and product enablement for next-generation High Bandwidth Memory (HBM) solutions. The position involves technical ownership of manufacturing KPIs including quality, cost, cycle time, and scale, with responsibilities spanning test flow development, yield improvement, reliability optimization, and cross-functional collaboration. The role requires a strong foundation in semiconductor device physics, circuit design, and data analysis, along with skills in problem-solving, scripting, and technical communication.

IDMOnsiteHIG

Key Responsibilities

  • Optimized Test Coverage: Ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes
  • Product Development and Validation: Developing, validating, characterizing, and qualifying Micron’s next-generation HBM products
  • Support for New Product Design Validation: Providing support for design verification and in-depth circuit analysis of new products using CAD tools and Verilog simulations
  • Yield Improvement and Cost Reduction: Improving manufacturing test yields related to DRAM, Interface, and Stacked Die issues, reducing test time, and resolving yield-related issues
  • Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues
  • Promotion of Innovation: Driving innovation and changes that provide Micron with a technical advantage over competition
  • Mentorship and Development of Others: Actively developing and mentoring team members
  • Technical Decision Making: Making final decisions on risk analysis and project prioritization
  • Cross-Functional Collaboration: Collaborating with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams

Requirements

  • Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field
  • Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus
  • Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP
  • Strong attention to detail and a commitment to quality
  • Ability to work effectively in team-based projects, contributing to shared goals and outcomes
  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment
  • Responsible and accountable, with a professional work ethic and ownership of assigned tasks
  • Clear and effective communication skills in written and spoken English, especially when articulating technical concepts and findings