About the role

AI summarised

Cost Engineer role within Micron's Lean Manufacturing team, focused on driving cost efficiency across High Bandwidth Memory (HBM), Component Assembly and Test, and SSD operations. The role involves managing cost improvement programs, performing month-end close activities, and collaborating with cross-functional teams to meet financial goals.

IDMFull-timeAssembly & Test

Key Responsibilities

Manage and introduce cost improvement programs across manufacturing operations High-bandwidth Memory (HBM), Multi-Chip Packages (MCP) and Low Power DRAM (LPDRAM) Component Assembly/Test/SSD.
Perform month-end close activities and drive performance to plan, including Capex optimization targets, Free Cash Flow (FCF) project deliverables, Material consumption performance to target, Financial Competitive Analysis for Cost Competitiveness benchmark.
Partner with Finance for quarterly business plan submissions, actual spending analysis and cost-per-part projections.
Act as the key integrator between Site Functional Teams and Central Cost Teams to ensure cost commitments are met and proliferate Best-Known Methods (BKMs) across the network and assess opportunities for site-level adoption.
Provide visibility into cost initiatives and performance metrics through dashboards and reporting tools.

Requirements

Bachelor's/Master's degree in Engineering, Finance, or a related field.
Prior experience in cost, manufacturing, finance, or operations is advantageous.
Strong analytical, logical, and critical thinking skills.
Effective communicator, able to collaborate across all levels.
Growth mindset with a passion for continuous learning.
Internship or experience in the semiconductor industry is a plus.
Demonstrated leadership and a track record of impact are highly desirable.
Interest in and knowledge of the semiconductor industry and Micron.
Familiarity with Lean principles and continuous improvement methodologies.
Proficiency in data visualization tools such as Power BI.