About the role
AI summarisedStaff Engineer leading strategic projects in Advanced Packaging & Technology Development at Micron, a semiconductor memory company. Responsible for program management, governance, and cross-functional coordination to accelerate yield maturity and packaging innovations.
IDMFull-timeAssembly & Test
Key Responsibilities
- Manage full lifecycle of PDE programs including planning, execution, monitoring, and closure.
- Define project missions, objectives, key deliverables, and resource requirements.
- Lead cross-functional teams across TD, HVM, CPI, DRAM, and NPI to ensure timely and quality delivery of strategic initiatives.
- Develop and implement standardized PMO methodologies, tools, and templates.
- Own CapEx and OpEx planning, PTM and MOR management, and BOP design systems integration.
- Ensure compliance with internal governance models and external customer requirements.
- Align project goals with PDE's mission to embed analytics and simulation into development workflows.
- Facilitate stakeholder communication across BU, PDT, TPM, and central engineering teams.
- Provide regular updates to leadership on project status, risks, and mitigation strategies.
- Develop and track KPIs for project success, yield reporting, and EOL accountability.
- Conduct project reviews to assess outcomes and identify lessons learned.
- Mentor project managers and promote continuous improvement across PMO practices.
Requirements
- Bachelor's or Master's degree in Engineering, Materials Science, or related technical field.
- 8+ years of experience in semiconductor packaging, process integration, or technology development.
- Proven track record in managing complex, cross-functional projects in a high-tech environment.
- Strong understanding of packaging flows including hybrid bonding, CoWoS, and chiplet integration.
- Excellent communication, leadership, and stakeholder management skills.
- Familiarity with Micron's Package Development, CPI, and NPI frameworks.
- Knowledge of simulation modeling, yield enhancement, and defectivity analysis.
