Micron Technology

Staff Engineer, Package Development & Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 months ago

About the role

AI summarised

Staff Engineer leading strategic projects in Advanced Packaging & Technology Development at Micron, a semiconductor memory company. Responsible for program management, governance, and cross-functional coordination to accelerate yield maturity and packaging innovations.

IDMFull-timeAssembly & Test

Key Responsibilities

  • Manage full lifecycle of PDE programs including planning, execution, monitoring, and closure.
  • Define project missions, objectives, key deliverables, and resource requirements.
  • Lead cross-functional teams across TD, HVM, CPI, DRAM, and NPI to ensure timely and quality delivery of strategic initiatives.
  • Develop and implement standardized PMO methodologies, tools, and templates.
  • Own CapEx and OpEx planning, PTM and MOR management, and BOP design systems integration.
  • Ensure compliance with internal governance models and external customer requirements.
  • Align project goals with PDE's mission to embed analytics and simulation into development workflows.
  • Facilitate stakeholder communication across BU, PDT, TPM, and central engineering teams.
  • Provide regular updates to leadership on project status, risks, and mitigation strategies.
  • Develop and track KPIs for project success, yield reporting, and EOL accountability.
  • Conduct project reviews to assess outcomes and identify lessons learned.
  • Mentor project managers and promote continuous improvement across PMO practices.

Requirements

  • Bachelor's or Master's degree in Engineering, Materials Science, or related technical field.
  • 8+ years of experience in semiconductor packaging, process integration, or technology development.
  • Proven track record in managing complex, cross-functional projects in a high-tech environment.
  • Strong understanding of packaging flows including hybrid bonding, CoWoS, and chiplet integration.
  • Excellent communication, leadership, and stakeholder management skills.
  • Familiarity with Micron's Package Development, CPI, and NPI frameworks.
  • Knowledge of simulation modeling, yield enhancement, and defectivity analysis.