Micron Technology

Senior Engineer, Process Development, Diffusion, NTI

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 3 weeks ago

About the role

AI summarised

The Senior Engineer, Process Development, Diffusion, NTI role at Micron's Singapore Technology Development team focuses on advancing NAND technology through process optimization, innovation, and global collaboration. The engineer will develop and troubleshoot unit processes, evaluate new equipment and materials, conduct experiments, and lead cross-functional initiatives to improve yield, quality, and manufacturability of next-generation memory devices. This position requires strong technical expertise in semiconductor processes, data analysis, and project leadership.

IDMOnsiteSTPG

Key Responsibilities

  • Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices
  • Evaluate innovative process and equipment solutions for early experimentation and process margin improvement
  • Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges
  • Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement
  • Partner with Boise TD Films teams to align future device requirements with process capabilities
  • Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams
  • Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation
  • Design and execute experiments to expand process margins and validate manufacturability of next-node solutions
  • Lead cross-functional initiatives to simplify processes and implement improvements
  • Embed best-known manufacturing practices into early-stage development of new nodes
  • Develop and apply advanced process monitoring and control methodologies
  • Serve as a technical expert, contributing to process, equipment, and procedural improvements

Requirements

  • Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics
  • Strong understanding of flow dynamics, thermodynamics, and physical phenomena in deposition
  • Strong understanding of precursor depletion effects in 3D structures and mitigation strategies
  • Strong understanding of interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)
  • Strong understanding of integration and structural constraints in film deposition processes
  • Strong understanding of memory process flows, especially for planar and vertical NAND
  • Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)
  • Excellent communication skills for both in-person and remote interactions
  • Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment