About the role
AI summarisedJoin Applied Materials, a global leader in materials engineering solutions, to drive material innovation at the intersection of advanced semiconductor fabrication and etch technology. This role involves designing, optimizing, and scaling cutting-edge thin-film etch processes for next-generation devices.
EquipmentOnsiteEngineering
Key Responsibilities
- Design and optimize thin-film etch processes using novel and commercial precursors for highly selective removal of dielectrics, metals, and complex material stacks in advanced semiconductor device fabrication.
- Conduct concept and feasibility R&D for plasma and thermal etch, including chemical formulations, process flows, and parameter optimization.
- Collaborate with business units and clients to optimize and scale etching processes for high-volume manufacturing.
- Troubleshoot and resolve technical challenges using structured root cause analysis, engaging cross-functional teams to implement solutions.
- Prepare and execute project plans for semiconductor film etch development, meeting milestones and deliverables on time and within budget.
Requirements
- Ph.D. in Materials Science, Chemistry, Physics, or Engineering (with strong emphasis on plasma chemistry and ALE)
- In-depth understanding of organic and metal-organic precursors, selective etching strategies (including plasma, thermal, and atomic layer etching), and associated intellectual property for advanced semiconductor applications.
- Strong understanding and hands-on experience in Conventional and Atomic Layer Etch (ALE) processes, plasma etching principles, and semiconductor device fabrication.
- Expertise in Si and Metal precursor-based ALE techniques, thin-film etch, and characterization for Memory and Logic devices.
- Solid knowledge of chemistry and chemical reactions in plasma/thermal environments and at material interfaces.
- Ability to correlate etch process parameters with device performance and reliability.