About the role
AI summarisedThe Principal/Senior Engineer in Advanced Package Metrology-Real-Time Defect Analysis (MRDA) will develop and optimize metrology recipes, establish inspection methodologies, and perform data analysis to support advanced packaging technology development. This role involves collaboration across teams to drive yield improvements and enable high-performance memory solutions. The engineer will contribute to equipment evaluation, long-range strategy, and process monitoring for semiconductor packaging innovation.
IDMOnsite
Key Responsibilities
- Develop and optimize metrology recipes for various semiconductor processes
- Ensure that the recipes are accurate and efficient for production needs
- Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)
- Establish inspection methodologies and best-known methods (BKM) for metrology processes
- Perform in-line characterization and validation of metrology recipes
- Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress
- Continuously analyze data to identify improvement opportunities and ensure process efficiency
- Identify, diagnose, and propose yield related breakthroughs
- Work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies
- Establish equipment evaluation and long-range strategy to enable advanced packaging technology roadmap
Requirements
- will result in immediate disqualification.