About the role
AI summarisedThis is an entry-level Tapeout Engineering role at GlobalFoundries, a leading semiconductor foundry. The engineer will support mask data preparation and tapeout activities, collaborate with cross-functional teams, and contribute to quality engineering and automation initiatives within Agile delivery teams.
FoundryFull-timeGeneral
Key Responsibilities
- Support semiconductor mask data preparation and tapeout activities, including layer generation and integration of OPC and ORC processes.
- Collaborate with cross‑functional teams to support pre‑tapeout design flows, frame generation, and end‑to‑end tapeout schedules to meet customer requirements.
- Assist in problem solving, planning, and testing across the tapeout and mask build flow to ensure accurate and on‑time photomask delivery.
- Participate in continuous improvement and automation initiatives to enhance tapeout and mask data preparation workflows.
- Assist in evaluation, testing, and adoption of new software tools and workflow enhancements.
- Work within Agile delivery teams to support embedded quality engineering activities during sprint‑based development.
- Collaborate with Product Owners and Business Analysts to refine user stories and acceptance criteria for clarity, completeness, and testability.
- Design and execute functional and end‑to‑end test cases; support System Integration Testing (SIT) and User Acceptance Testing (UAT).
- Validate positive and negative flows, edge cases, and basic non‑functional requirements such as performance and security awareness.
- Identify requirement gaps, inconsistencies, and risks early, providing technical feedback under senior guidance.
- Log, track, and triage defects; contribute to root cause analysis, quality metrics, and continuous improvement initiatives.
- Provide technical support to field engineering, customer engineering, and process owners as needed.
Requirements
- Bachelor's Degree in Engineering, Computer Science, Electronics, Electrical Engineering, or a related technical discipline.
- Experience or strong interest in semiconductor manufacturing flows, mask data preparation, or tapeout processes.
- Foundational knowledge of photomask generation, OPC/ORC concepts, and pre‑tapeout design flows.
- Exposure to Agile or DevOps environments, with understanding of sprint‑based development and quality engineering practices.
- Experience designing and executing functional and end‑to‑end tests, defect tracking, and test documentation.
- Familiarity with software validation, workflow automation, or digital transformation initiatives is a plus.
- Strong analytical and problem‑solving skills with attention to detail and process quality.
- Effective communication skills with the ability to collaborate across engineering, product, and manufacturing teams.
- Ability to work effectively in evolving environments and adapt to changing priorities.