About the role
AI summarisedThe Engineer in Product Development Engineering Key Equipment Group (PDE KEG) is responsible for identifying, evaluating, and qualifying new equipment and technologies to support advanced packaging requirements. This role involves collaboration with production and supplier teams to install, qualify, and handover equipment, maintain equipment capability matrices, and drive continuous improvement through AI-assisted tools and process enhancements. The position requires foundational knowledge in semiconductor packaging, basic experience in the industry, and strong analytical and communication skills.
IDMOnsiteAssembly & Test
Key Responsibilities
- Identify, select, and evaluate new equipment and technology to support current and future advanced packaging requirements
- Install and qualify new equipment platforms and handover to production group
- Maintain a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platforms
- Collaborate with production groups on upgrades of existing production equipment through continuous improvement projects
- Define, develop, and establish new equipment design/capability requirements aligned to Process and Packaging Roadmap
- Develop creative solutions for new equipment capabilities to address identified constraints or future technology requirements
- Work with equipment suppliers to develop new capabilities
- Engage in Package Development Engineering activities
- Conduct equipment benchmarking to establish equipment suppliers and platforms for future needs
- Assist senior engineers in equipment benchmarking and selection activities
- Plan and submit capital requests to acquire new equipment
Requirements
- PhD/Masters/bachelor’s degree in Electrical & Electronic, Materials, Mechanical Engineering, Physics & Applied Physics or equivalent
- Basic knowledge in semiconductor manufacturing assembly, wafer bumping, packaging technologies & advanced packaging techniques
- 0-2 years’ experience in related semiconductor industry or related manufacturing environment
- Experience with technical knowledge on assembly and/or wafer bumping and/or advanced packaging technology is a plus
- Understanding and/or experience in equipment automation solutions is a plus
- Fast learner with initiative and independence (min supervision)
- Good team player with ability to integrate and cooperate with cross-functional teams and external vendors
- Strong communication (verbal & written) and presentation skills (English speaking is required)
- Understanding of business needs and customer requirements, able to participate in cross-functional team environments
- Strong project management skills to ensure execution to timelines
- Strong analytical, logical, and critical thinking skills
- Growth mindset with passion for continuous learning
- Internship or experience in the semiconductor industry is a