Scientist, W2W Bonding, (APM), IME

Key Responsibilities

• Process Innovation: Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory.
• Material Science: Investigating and selecting appropriate bonding materials (e.g., low-temperature organic/inorganic materials, Cu/oxide, Cu/polymer) to ensure strong and stable interfaces.
• Parameter Optimization: Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (e.g., CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy.
• Problem Solving: Addressing challenges related to process integration, such as wafer warpage, thermal budget constraints, contamination, and the reduction of thermo-mechanical stress.
• Process Evaluation: Coordinating and executing comprehensive evaluations of new processes, materials, and equipment.
• Reliability Testing: Conducting electrical, thermal, and mechanical reliability characterization of bonded structures (e.g., using SEM, SAM, AFM) to validate performance and ensure manufacturing guidelines are met.
• Data Analysis: Utilizing metrology tools and data analysis to assess surface topography, void defects, and bond quality, and driving quality improvements based on these findings.
• Project Leadership: Conceiving, planning, and leading high-impact projects, often involving external partners and stakeholders.
• Technology Roadmapping: Collaborating with senior staff and process integrators to define and address future technology roadmaps and business challenges in advanced packaging.
• Intellectual Property: Generating detailed reports and contributing to the creation of new intellectual property (IPs) and knowledge areas to strengthen the company's portfolio.
• Mentorship: Inspiring and mentoring scientists, engineers and technicians in advanced semiconductor technologies.