About the role
AI summarisedSenior Process Engineer (Lithography) at STMicroelectronics, a global semiconductor company. Responsible for developing, monitoring, and optimizing photolithography, screen printing, and bonding processes for MEMS technology, with a focus on ASML i-Line steppers. Requires a bachelor's degree in engineering or physics and hands-on experience with photolithography equipment.
IDMFull-timeProcess Engineering
Key Responsibilities
- Operate and optimize Photolithography equipment for ASML i-Line Stepper Systems, by defining and tuning process recipes (focus, exposure dose, alignment, etc.)
- Perform routine process monitoring and troubleshooting on ASML i-Line steppers, including tool qualification, SPC tracking, and defect analysis, ensuring stable and repeatable process performance.
- Analyze process and metrology data to identify improvement opportunities, drive root-cause analysis, and implement robust corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability.
- Assist in MEMS technology development, focusing on the setup and optimization of Photolithography, Screen Printing, and Bonding processes in a semiconductor environment.
- Assist in the development, characterization, and optimization of Photolithography, Screen Printing, and Bonding processes for semiconductor manufacturing.
- Monitor and control process to ensure consistent and high-quality output.
- Troubleshoot process issues and implement corrective actions.
- Maintain detailed documentation of process parameters, experiments, and results.
- Prepare technical reports and presentations to communicate findings and recommendations to the engineering team.
- Update process documentation and standard operating procedures (SOPs) as needed.
- Work closely with cross-functional teams, including R&D, production, and quality assurance, to ensure seamless integration of photolithography, screen printing and bonding processes.
- Participate in team meetings and contribute to problem-solving discussions.
Requirements
- Bachelor's degree in Electrical & Electronics, Mechatronics, Physics/Applied Physics, Materials Science, Chemical or Mechanical Engineering.
- Understanding of photolithography or bonding principle and semiconductor process.
- Knowledge of EKRA printing and bonding processes will be considered an advantage.
- Knowledge of data analysis and statistical process control.
- Hands-on experience with photolithography equipment (Track: DNS/TEL, Stepper: Canon/ASML, Aligner: EVG/SUSS), Screen printing (EKRA) and Bonding (EVG) equipment is highly desirable.
- Good communication and teamwork skills.
- Work independently and able to do multitask effectively.