About the role
AI summarisedAs a Principal Engineer focusing on Chemical Mechanical Planarization (CMP), you will be a key technical leader in the Process Module team at GlobalFoundries. You will be responsible for developing, optimizing, and sustaining cutting-edge CMP processes critical to our semiconductor fabrication technology nodes, requiring deep technical expertise and strategic problem-solving abilities.
FoundryOnsite
Key Responsibilities
- Develop and modify CMP process formulations, methods, and tool controls to meet stringent quality standards.
- Analyze technical data and charts to ensure CMP performance, focusing on non-uniformity, defectivity, and removal rate stability.
- Establish and maintain Standard Operating Procedures (SOPs) and Failure Mode and Effects Analysis (FMEA) specific to the CMP module.
- Integrate CMP equipment capabilities and material systems to meet process module and technology specifications.
- Lead recipe creation, maintenance, and optimization for CMP metrology tools to ensure accurate process monitoring.
- Drive Continuous Improvement Plans (CIPs) to enhance process performance and productivity.
- Serve as a technical subject matter expert for CMP, providing guidance and training to junior engineers.
- Solve complex, novel, and non-recurring technical problems related to CMP processes.
Requirements
- Master’s or Bachelor’s Degree in Electrical, Electronics, Mechanical, Chemical, Materials Science Engineering, or related field.
- 5 to 8 years of relevant experience in the wafer fabrication industry with a strong focus on CMP.
- Proficiency in analytical and project management skills.
- Familiarity with SPC, DOE & FMEA methodologies.
- Strong interpersonal and communication skills.
- Proven ability to work in cross-functional teams.