About the role
AI summarisedResponsible for managing and resolving manufacturing, quality, and yield issues related to IC substrate packaging by working closely with subcontractors and internal engineering teams to drive high-volume manufacturing maturity.
FablessOnsite
Key Responsibilities
- Manage and resolve packaging, manufacturing, yield, quality, and delivery issues with IC substrate subcontractors.
- Support NPI activities, risk assessments, process improvement, and production engineering for high-volume IC substrate manufacturing.
- Collaborate with internal cross-functional engineering teams to resolve issues and drive high-volume manufacturing maturity for newly developed packaging technology.
- Lead pre-production engineering activities and drive improvements in process, visual mechanical yields, and cycle time.
- Drive standardization of Best Known Methods on-site and verify compliance with Broadcom requirements.
- Lead capability enhancement and cost reduction projects.
Requirements
- Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical, or Electrical).
- 8 years' experience in IC substrate manufacturing technologies and processes.
- Direct process and operational experience in a substrate manufacturing operations line is required.
- Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, and packaging materials is required.
- Proven track record managing substrate technical specifications that impact downstream assembly margins.
- Direct process and operational experience in a manufacturing environment.
- Proven ability to manage complex activities across multiple groups including operations, quality, business units, suppliers, marketing, and customers.
- Thorough knowledge of problem-solving methodologies and failure analysis techniques.